When potting electronics, components on a printed circuit board are completely insulated and well protected against environmental influences. Mavom's range of potting resins consists of silicones, polyurethanes, epoxies or hybrid products. There is a wide variety of viscosities, hardness and curing options. A number of products also meet certain standards such as EN 45545-2, UL or mil specs.

Applying a conformal coating, a specially developed thin layer of lacquer, is a relatively simple way to protect a printed circuit board (PCB) against environmental influences. With a conformal coating, a selective area of ​​the printed circuit board can be treated, repairs are easier to make and coverage is easy to check due to the presence of fluorescing additives in the lacquer, that will light up under black light

Higher Power on smaller surfaces as a result of product miniaturization result in extra heat development. With the use of heat-conducting products, this heat can be efficiently dissipated so that the reliability and lifespan of the electronic components is not negatively affected.

Designers are increasingly discovering the advantages of adhesives in comparison with traditional joining techniques. Bonding offers you new possibilities such as joining dissimilar materials. Applications within electronics are wide: Bonding SMA components, fixing large components, sealing of housings, Bonding a PCB in a housing, etc. The Bonding process is also ideal for automation.

Electrically conductive adhesives are adhesives that are usually filled with metal particles such as silver or graphite and are used to electrically connect components together. Typical applications are the bonding of small components to temperature-sensitive substrates such as flex prints. These products are also used as a replacement for solder pastes in applications where large thermal cycles are required.

On a printed circuit board there can be naked chips on sensitive components that need to be individually protected. Various techniques are available to protect such components against environmental influences and mechanically, such as Glob top and Dam & fill.

Underfill products are 1-component, epoxy-based products that fill the air bubble-free layer between BGA, CSP, flip chip and the printed circuit board and thus protect the active side of the component. At the same time, this layer reduces the thermal stress on the solder joints. This technique protects the components against shocks, vibrations and exposure to varying temperatures. Important properties for this type of product are a high glass transition temperature, low expansion coefficient and very good flow.

An important property for optical applications is that they do not yellow under the influence of UV and temperature. When it comes to semi-conductor applications, such as LED packages or optical lenses, it is also a requirement that the products have a high refractive index and a low ion content. In addition to optical products for the semiconductor industry, Mavom also offers die-attach, die-encapsulants and spin-on dielectric products.

Cleaning is a crucial step in the production and use of electronics. Contact cleaners remove contamination and corrosion on electrical contacts, while other products dissolve flux residue after soldering. Proper cleaning of printed circuit boards ensures better adhesion when pouring, coating and Bonding.